Get Area Array Packaging Handbook: Manufacturing and Assembly PDF

By Ken Gilleo

*Covers layout, packaging, development, meeting, and alertness of all 3 ways to quarter Array Packaging: Ball Grid Array (BGA), Chip Scale package deal (CSP), and turn Chip (FC) *Details the professionals and cons of every know-how with various purposes *Examines packaging ramifications of excessive density interconnects (HDI)

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Area Array Packaging Handbook: Manufacturing and Assembly (McGraw-Hill Handbooks) by Ken Gilleo


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